74HC30; 74HCT30

参数类型

型号	V_CC (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	Package name
74HC30D	2.0 - 6.0	CMOS	± 5.2	12	36	1	low	-40~125	SO14
74HC30PW	2.0 - 6.0	CMOS	± 5.2	12	36	1	low	-40~125	TSSOP14
74HCT30D	4.5 - 5.5	TTL	± 4	12	36	1	low	-40~125	SO14
74HCT30PW	4.5 - 5.5	TTL	± 4	12	36	1	low	-40~125	TSSOP14

封装

型号	可订购的器件编号，（订购码(12NC)）	状态	标示	封装	外形图	回流焊/波峰焊	包装
74HC30D	74HC30D,653 (933756910653)	Active	74HC30D	SO14 (SOT108-1)	SOT108-1	SO-SOJ-REFLOW SO-SOJ-WAVE WAVE_BG-BD-1	暂无信息
74HC30PW	74HC30PW,118 (935189030118)	Active	HC30	TSSOP14 (SOT402-1)	SOT402-1	SSOP-TSSOP-VSO-WAVE	SOT402-1_118
74HCT30D	74HCT30D,653 (933756930653)	Active	74HCT30D	SO14 (SOT108-1)	SOT108-1	SO-SOJ-REFLOW SO-SOJ-WAVE WAVE_BG-BD-1	暂无信息
74HCT30PW	74HCT30PW,118 (935189600118)	Active	HCT30	TSSOP14 (SOT402-1)	SOT402-1	SSOP-TSSOP-VSO-WAVE	SOT402-1_118

下表中的所有产品型号均已停产。

型号	可订购的器件编号，（订购码(12NC)）	状态	标示	封装	外形图	回流焊/波峰焊	包装
74HC30D	74HC30D,652 (933756910652)	Withdrawn / End-of-life	74HC30D	SO14 (SOT108-1)	SOT108-1	SO-SOJ-REFLOW SO-SOJ-WAVE WAVE_BG-BD-1	SOT108-1_652
74HC30DB	74HC30DB,112 (935188670112)	Obsolete	HC30	SSOP14 (SOT337-1)	SOT337-1	SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE	暂无信息
74HC30DB	74HC30DB,118 (935188670118)	Obsolete	HC30	SSOP14 (SOT337-1)	SOT337-1		SOT337-1_118
74HCT30DB	74HCT30DB,112 (935189310112)	Obsolete	HCT30	SSOP14 (SOT337-1)	SOT337-1	SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE	暂无信息
74HCT30DB	74HCT30DB,118 (935189310118)	Obsolete	HCT30	SSOP14 (SOT337-1)	SOT337-1		SOT337-1_118

环境信息

型号	可订购的器件编号	化学成分	RoHS	RHF指示符
74HC30D	74HC30D,653	74HC30D
74HC30PW	74HC30PW,118	74HC30PW
74HCT30D	74HCT30D,653	74HCT30D
74HCT30PW	74HCT30PW,118	74HCT30PW

下表中的所有产品型号均已停产。

型号	可订购的器件编号	化学成分	RoHS	RHF指示符
74HC30D	74HC30D,652	74HC30D
74HC30DB	74HC30DB,112	74HC30DB
74HC30DB	74HC30DB,118	74HC30DB
74HCT30DB	74HCT30DB,112	74HCT30DB
74HCT30DB	74HCT30DB,118	74HCT30DB

品质及可靠性免责声明

文档 (17)

文件名称	标题	类型	日期
74HC_HCT30	8-input NAND gate	Data sheet	2024-03-13
AN11044	Pin FMEA 74HC/74HCT family	Application note	2019-01-09
SOT108-1	3D model for products with SOT108-1 package	Design support	2020-01-22
SOT402-1	3D model for products with SOT402-1 package	Design support	2023-02-02
Nexperia_package_poster	Nexperia package poster	Leaflet	2020-05-15
SO14_SOT108-1_mk	plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body	Marcom graphics	2017-01-28
SSOP14_SOT337-1_mk	plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body	Marcom graphics	2017-01-28
TSSOP14_SOT402-1_mk	plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body	Marcom graphics	2017-01-28
SOT108-1	plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body	Package information	2023-11-07
SOT337-1	plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body	Package information	2020-04-21
SOT402-1	plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body	Package information	2023-11-07
SO-SOJ-REFLOW	Footprint for reflow soldering	Reflow soldering	2009-10-08
SSOP-TSSOP-VSO-REFLOW	Footprint for reflow soldering	Reflow soldering	2009-10-08
HCT_USER_GUIDE	HC/T User Guide	User manual	1997-10-31
SO-SOJ-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08

支持

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模型

文件名称	标题	类型	日期
SOT108-1	3D model for products with SOT108-1 package	Design support	2020-01-22
SOT402-1	3D model for products with SOT402-1 package	Design support	2023-02-02

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