74LVC273

参数类型

型号	V_CC (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	Power dissipation considerations	T_amb (°C)	Package name
74LVC273BQ	1.2 - 3.6	CMOS/LVTTL	± 24	6.0	230	low	-40~125	DHVQFN20
74LVC273D	1.2 - 3.6	CMOS/LVTTL	± 24	6.0	230	low	-40~125	SO20
74LVC273PW	1.2 - 3.6	CMOS/LVTTL	± 24	6.0	230	low	-40~125	TSSOP20

封装

型号	可订购的器件编号，（订购码(12NC)）	状态	标示	封装	外形图	回流焊/波峰焊	包装
74LVC273BQ	74LVC273BQ,115 (935273677115)	Active	LVC273	DHVQFN20 (SOT764-1)	SOT764-1		SOT764-1_115
74LVC273D	74LVC273D,118 (935210640118)	Active	74LVC273D	SO20 (SOT163-1)	SOT163-1	WAVE_BG-BD-1	SOT163-1_118
74LVC273PW	74LVC273PW,118 (935210650118)	Active	LVC273	TSSOP20 (SOT360-1)	SOT360-1	SSOP-TSSOP-VSO-WAVE	SOT360-1_118

下表中的所有产品型号均已停产。

型号	可订购的器件编号，（订购码(12NC)）	状态	标示	封装	外形图	回流焊/波峰焊	包装
74LVC273D	74LVC273D,112 (935210640112)	Withdrawn / End-of-life	74LVC273D	SO20 (SOT163-1)	SOT163-1	WAVE_BG-BD-1	暂无信息
74LVC273DB	74LVC273DB,112 (935174740112)	Obsolete	LVC273	SSOP20 (SOT339-1)	SOT339-1	SSOP-TSSOP-VSO-WAVE	暂无信息
74LVC273DB	74LVC273DB,118 (935174740118)	Withdrawn / End-of-life	LVC273	SSOP20 (SOT339-1)	SOT339-1		SOT339-1_118
74LVC273PW	74LVC273PW,112 (935210650112)	Withdrawn / End-of-life	LVC273	TSSOP20 (SOT360-1)	SOT360-1	SSOP-TSSOP-VSO-WAVE	暂无信息

环境信息

型号	可订购的器件编号	化学成分	RoHS	RHF指示符
74LVC273BQ	74LVC273BQ,115	74LVC273BQ
74LVC273D	74LVC273D,118	74LVC273D
74LVC273PW	74LVC273PW,118	74LVC273PW

下表中的所有产品型号均已停产。

型号	可订购的器件编号	化学成分	RoHS	RHF指示符
74LVC273D	74LVC273D,112	74LVC273D
74LVC273DB	74LVC273DB,112	74LVC273DB
74LVC273DB	74LVC273DB,118	74LVC273DB
74LVC273PW	74LVC273PW,112	74LVC273PW

品质及可靠性免责声明

文档 (19)

文件名称	标题	类型	日期
74LVC273	Octal D-type flip-flop with reset; positive-edge trigger	Data sheet	2023-08-25
AN11009	Pin FMEA for LVC family	Application note	2019-01-09
AN263	Power considerations when using CMOS and BiCMOS logic devices	Application note	2023-02-07
mna763	Block diagram: 74LVC273BQ, 74LVC273D, 74LVC273DB, 74LVC273PW, 74LVT273BQ, 74LVT273D, 74LVT273DB, 74LVT273PW	Block diagram	2009-11-03
SOT764-1	3D model for products with SOT764-1 package	Design support	2019-10-03
SOT163-1	3D model for products with SOT163-1 package	Design support	2020-01-22
SOT360-1	3D model for products with SOT360-1 package	Design support	2020-01-22
lvc273	lvc273 IBIS model	IBIS model	2013-04-08
Nexperia_package_poster	Nexperia package poster	Leaflet	2020-05-15
DHVQFN20_SOT764-1_mk	plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body	Marcom graphics	2017-01-28
TSSOP20_SOT360-1_mk	plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body	Marcom graphics	2017-01-28
SOT764-1	plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body	Package information	2022-06-21
SOT163-1	plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body	Package information	2024-11-15
SOT339-1	plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body	Package information	2020-04-21
SOT360-1	plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body	Package information	2024-11-15
lvc	lvc Spice model	SPICE model	2013-05-07
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08

支持

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模型

文件名称	标题	类型	日期
SOT764-1	3D model for products with SOT764-1 package	Design support	2019-10-03
SOT163-1	3D model for products with SOT163-1 package	Design support	2020-01-22
SOT360-1	3D model for products with SOT360-1 package	Design support	2020-01-22
lvc273	lvc273 IBIS model	IBIS model	2013-04-08
lvc	lvc Spice model	SPICE model	2013-05-07

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