参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVC2G04GM | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | XSON6 |
74LVC2G04GN | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | XSON6 |
74LVC2G04GS | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | XSON6 |
74LVC2G04GV | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | TSOP6 |
74LVC2G04GW | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | TSSOP6 |
74LVC2G04GX | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | X2SON6 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC2G04GM | 74LVC2G04GM,115 (935277161115) |
Active | V4 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
74LVC2G04GM,132 (935277161132) |
Active | V4 | SOT886_132 | ||||
74LVC2G04GN | 74LVC2G04GN,132 (935291798132) |
Active | V4 |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
74LVC2G04GS | 74LVC2G04GS,132 (935292926132) |
Active | V4 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
74LVC2G04GV | 74LVC2G04GV,125 (935273525125) |
Active | V04 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
74LVC2G04GW | 74LVC2G04GW,125 (935273523125) |
Active | V4 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
74LVC2G04GX | 74LVC2G04GXZ (935307076147) |
Active | V4 |
X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC2G04GF | 74LVC2G04GF,132 (935282429132) |
Withdrawn / End-of-life | V4 |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
SOT891_132 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC2G04GM | 74LVC2G04GM,115 | 74LVC2G04GM | ||
74LVC2G04GM | 74LVC2G04GM,132 | 74LVC2G04GM | ||
74LVC2G04GN | 74LVC2G04GN,132 | 74LVC2G04GN | ||
74LVC2G04GS | 74LVC2G04GS,132 | 74LVC2G04GS | ||
74LVC2G04GV | 74LVC2G04GV,125 | 74LVC2G04GV | ||
74LVC2G04GW | 74LVC2G04GW,125 | 74LVC2G04GW | ||
74LVC2G04GX | 74LVC2G04GXZ | 74LVC2G04GX |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC2G04GF | 74LVC2G04GF,132 | 74LVC2G04GF |
文档 (36)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC2G04 | Dual inverter | Data sheet | 2023-08-15 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
mnb079 | Block diagram: 74LVC2G04GF, 74LVC2G04GM, 74LVC2G04GV, 74LVC2G04GW, 74AUP2G04GF, 74AUP2G04GM, 74AUP2G04GW, 74HC2G04GV, 74HC2G04GW, 74HC2GU04GV, 74HC2GU04GW, 74HCT2G04GV, 74HCT2G04GW | Block diagram | 2009-11-04 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
lvc2g04 | 74LVC2G04 IBIS model | IBIS model | 2015-09-06 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
lvc2g04 | 74LVC2G04 IBIS model | IBIS model | 2015-09-06 |
Ordering, pricing & availability
样品
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