参数类型
| 型号 | Package version | Package name | Size (mm) | channel type (e) | Configuration | Ptot (mW) | IC [max] (mA) | hFE [min] | hFE [min] | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|
| BCV26 | SOT23 | SOT23 | 2.9 x 1.3 x 1 | PNP | 2 | 250 | -500 | 20000 | 10000 | 4000 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BCV26 | BCV26,215 (933806210215) |
Active | FD% |
(SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
| BCV26,235 (933806210235) |
Active | FD% | SOT23_235 |
文档 (9)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BCV26_BCV46 | PNP Darlington transistors | Data sheet | 2022-10-11 |
| SOT23 | 3D model for products with SOT23 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT23_mk | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
| SOT23 | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Package information | 2022-10-12 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
