参数类型
| 型号 |
|---|
封装
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| CBT3125D | CBT3125D,112 (935270672112) |
Obsolete | CBT3125D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_112 |
| CBT3125D,118 (935270672118) |
Obsolete | CBT3125D | SOT108-1_118 | ||||
| CBT3125DB | CBT3125DB,112 (935270671112) |
Obsolete | CT3125 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
| CBT3125DB,118 (935270671118) |
Obsolete | CT3125 | SOT337-1_118 | ||||
| CBT3125DS | CBT3125DS,112 (935270673112) |
Obsolete | CBT3125 Standard Procedure Standard Procedure |
SSOP16 (SOT519-1) |
SOT519-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
| CBT3125DS,118 (935270673118) |
Obsolete | CBT3125 Standard Procedure Standard Procedure | SOT519-1_118 | ||||
| CBT3125PW | CBT3125PW/G,118 (935277135118) |
Obsolete | 3125/G Standard Procedure Standard Procedure |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| CBT3125PW,112 (935270670112) |
Obsolete | CBT3125 | 暂无信息 | ||||
| CBT3125PW,118 (935270670118) |
Obsolete | CBT3125 | SOT402-1_118 |
环境信息
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBT3125D | CBT3125D,112 | CBT3125D |
|
|
| CBT3125D | CBT3125D,118 | CBT3125D |
|
|
| CBT3125DB | CBT3125DB,112 | CBT3125DB |
|
|
| CBT3125DB | CBT3125DB,118 | CBT3125DB |
|
|
| CBT3125DS | CBT3125DS,112 | CBT3125DS |
|
|
| CBT3125DS | CBT3125DS,118 | CBT3125DS |
|
|
| CBT3125PW | CBT3125PW/G,118 | CBT3125PW |
|
|
| CBT3125PW | CBT3125PW,112 | CBT3125PW |
|
|
| CBT3125PW | CBT3125PW,118 | CBT3125PW |
|
|
文档 (20)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| CBT3125 | Quadruple FET bus switch | Data sheet | 2018-10-01 |
| AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| cbt3125 | cbt3125 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT519-1 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | Package information | 2022-06-20 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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