参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVC2G16GM | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | XSON6 |
74LVC2G16GW | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | TSSOP6 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC2G16GM | 74LVC2G16GMH (935307598125) |
Active | YU |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
74LVC2G16GW | 74LVC2G16GWH (935307602125) |
Active | YU |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC2G16GF | 74LVC2G16GFH (935307599125) |
Obsolete | YU |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
暂无信息 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC2G16GM | 74LVC2G16GMH | 74LVC2G16GM | ||
74LVC2G16GW | 74LVC2G16GWH | 74LVC2G16GW |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC2G16GF | 74LVC2G16GFH | 74LVC2G16GF |
文档 (17)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC2G16 | Dual buffer gate | Data sheet | 2023-08-18 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
lvc2g16 | 74LVC2G16 IBIS model | IBIS model | 2015-11-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
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