封装
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74AXP2G34GM | 74AXP2G34GMH (935306671125) |
Obsolete | no package information | ||||
| 74AXP2G34GN | 74AXP2G34GNH (935306672125) |
Withdrawn / End-of-life | RA |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
暂无信息 |
| 74AXP2G34GS | 74AXP2G34GSH (935306673125) |
Obsolete | no package information | ||||
环境信息
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AXP2G34GM | 74AXP2G34GMH | 74AXP2G34GM |
|
|
| 74AXP2G34GN | 74AXP2G34GNH | 74AXP2G34GN |
|
|
| 74AXP2G34GS | 74AXP2G34GSH | 74AXP2G34GS |
|
|
文档 (11)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74AXP2G34 | Low-power dual buffer | Data sheet | 2017-03-30 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| axp2g34 | 74AXP2G34 IBIS model | IBIS model | 2015-11-04 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
支持
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Ordering, pricing & availability
样品
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