参数类型
型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
---|---|---|---|---|---|---|---|---|---|---|
74AVC4T774BQ | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | DHVQFN16 | Bi-directional | Direction controlled |
74AVC4T774GU | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | XQFN16 | Bi-directional | Direction controlled |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AVC4T774BQ | 74AVC4T774BQX (935341326115) |
Active | C4T774 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
74AVC4T774GU | 74AVC4T774GUX (935341327115) |
Active |
XQFN16 (SOT1161-1) |
SOT1161-1 | SOT1161-1_115 | ||
74AVC4T774GUZ (935341327184) |
Active | SOT1161-1_184 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AVC4T774BQ | 74AVC4T774BQX | 74AVC4T774BQ | ||
74AVC4T774GU | 74AVC4T774GUX | 74AVC4T774GU | ||
74AVC4T774GU | 74AVC4T774GUZ | 74AVC4T774GU |
文档 (10)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AVC4T774 | 4-bit dual supply translating transceiver; 3-state | Data sheet | 2024-06-25 |
Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
SOT1161-1 | 3D model for products with SOT1161-1 package | Design support | 2023-02-07 |
avc4t774 | AVC4T774 IBIS model | IBIS model | 2017-10-04 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SOT1161-1 | plastic, leadless extermely thin quad flat package; 16 terminals; 0.4 mm pitch; 2.6 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-15 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
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