封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74LV14ABZ | 74LV14ABZZ (935691129147) |
Active | 214 |
DHXQFN14 (SOT8014-1) |
SOT8014-1 | SOT8014-1_147 | |
| 74LV14APW | 74LV14APWJ (935308161118) |
Active | LV14A |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74LV14ABZ | 74LV14ABZX (935691129115) |
Withdrawn / End-of-life | 214 |
DHXQFN14 (SOT8014-1) |
SOT8014-1 | 暂无信息 |
文档 (10)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74LV14A | Hex inverting Schmitt trigger | Data sheet | 2024-04-08 |
| SOT8014-1 | 3D model for products with SOT8014-1 package | Design support | 2023-02-02 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lv14a | 74LV14A IBIS Model | IBIS model | 2021-02-02 |
| Nexperia_document_leaflet_Logic_LV-AT_201903 | LV-A(T) logic family | Leaflet | 2019-03-19 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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