双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC1G17-Q100

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74LVC1G17GM-Q100 1.65 - 5.5 CMOS/LVTTL ± 32 175 1 low -40~125 XSON6
74LVC1G17GV-Q100 1.65 - 5.5 CMOS/LVTTL ± 32 175 1 low -40~125 TSOP5
74LVC1G17GW-Q100 1.65 - 5.5 CMOS/LVTTL ± 32 175 1 low -40~125 TSSOP5

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC1G17GM-Q100 74LVC1G17GM-Q100X
(935690764115)
Active VJ SOT886
XSON6
(SOT886)
SOT886 REFLOW_BG-BD-1
SOT886_115
74LVC1G17GV-Q100 74LVC1G17GV-Q100,1
(935298482125)
Active V17 SOT753
TSOP5
(SOT753)
SOT753 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125
74LVC1G17GW-Q100 74LVC1G17GW-Q100,1
(935298483125)
Active VJ SOT353-1
TSSOP5
(SOT353-1)
SOT353-1 WAVE_BG-BD-1
SOT353-1_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC1G17GM-Q100 74LVC1G17GM-Q100X 74LVC1G17GM-Q100 rohs rhf rhf
74LVC1G17GV-Q100 74LVC1G17GV-Q100,1 74LVC1G17GV-Q100 rohs rhf rhf
74LVC1G17GW-Q100 74LVC1G17GW-Q100,1 74LVC1G17GW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (19)

文件名称 标题 类型 日期
74LVC1G17_Q100 Single Schmitt trigger buffer Data sheet 2024-11-15
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
lvc1g17 74LVC1G17 IBIS model IBIS model 2018-05-25
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT753 plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body Package information 2022-05-31
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT753 MAR_SOT753 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

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模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
lvc1g17 74LVC1G17 IBIS model IBIS model 2018-05-25

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