参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74AUP1G58GM | 0.8 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | XSON6 |
74AUP1G58GN | 0.8 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | XSON6 |
74AUP1G58GS | 0.8 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | XSON6 |
74AUP1G58GW | 0.8 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | TSSOP6 |
74AUP1G58GX | 0.8 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | X2SON6 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AUP1G58GM | 74AUP1G58GM,115 (935279961115) |
Active | aK |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
74AUP1G58GM,132 (935279961132) |
Active | aK | SOT886_132 | ||||
74AUP1G58GN | 74AUP1G58GN,132 (935291744132) |
Active | aK |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
74AUP1G58GS | 74AUP1G58GS,132 (935292868132) |
Active | aK |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
74AUP1G58GW | 74AUP1G58GW,125 (935279959125) |
Active | aK |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
74AUP1G58GX | 74AUP1G58GXZ (935307122147) |
Active | aK |
X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AUP1G58GF | 74AUP1G58GF,132 (935281329132) |
Obsolete | aK |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
SOT891_132 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AUP1G58GM | 74AUP1G58GM,115 | 74AUP1G58GM | ||
74AUP1G58GM | 74AUP1G58GM,132 | 74AUP1G58GM | ||
74AUP1G58GN | 74AUP1G58GN,132 | 74AUP1G58GN | ||
74AUP1G58GS | 74AUP1G58GS,132 | 74AUP1G58GS | ||
74AUP1G58GW | 74AUP1G58GW,125 | 74AUP1G58GW | ||
74AUP1G58GX | 74AUP1G58GXZ | 74AUP1G58GX |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AUP1G58GF | 74AUP1G58GF,132 | 74AUP1G58GF |
文档 (29)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AUP1G58 | Low-power configurable multiple function gate | Data sheet | 2023-07-24 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
aup1g58 | aup1g58 IBIS model | IBIS model | 2015-09-06 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812 | Single configurable logic | Leaflet | 2019-01-04 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
aup1g58 | aup1g58 IBIS model | IBIS model | 2015-09-06 |
Ordering, pricing & availability
样品
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