参数类型
| 型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC4T3144PW | 1.2 - 5.5 | 1.2 - 5.5 | CMOS/LVTTL | ± 8 | 13.2 | 1 | low | -40~125 | TSSOP14 | Uni-directional |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74LVC4T3144PW | 74LVC4T3144PWJ (935339706118) |
Active | C4T3144 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
文档 (10)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74LVC4T3144 | 4-bit dual supply buffer/line driver; 3-state | Data sheet | 2024-02-22 |
| Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lvc4t3144 | 74LVC4T3144 IBIS model | IBIS model | 2017-08-16 |
| 74AVC4T3144_and_74LVC4T3144_leaflet | Dual supply translating buffers/line drivers | Leaflet | 2018-03-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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