参数类型
| 型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP55 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650.0 | 60.0 | 1000.0 | 63.0 | 250.0 | 150 | 100.0 | Y |
| BCP55-10 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650.0 | 60.0 | 1000.0 | 63.0 | 160.0 | 150 | 100.0 | Y |
| BCP55-16 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650.0 | 60.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 | Y |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BCP55 | BCP55,115 (933917210115) |
Active | BCP55 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BCP55,135 (933917210135) |
Active | BCP55 | SOT223_135 | ||||
| BCP55-10 | BCP55-10,115 (933917220115) |
Active | BCP55 /10 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BCP55-16 | BCP55-16,115 (933917230115) |
Active | BCP55 /16 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BCP55-16F (933917230135) |
Active | BCP55 /16 | SOT223_135 |
文档 (7)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BCP55_SER | 60 V, 1 A NPN medium power transistors | Data sheet | 2022-06-30 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
