参数类型
| 型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC55-10PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 60.0 | 1000.0 | 63.0 | 160.0 | 150 | 100.0 | Y |
| BC55-16PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 60.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 | Y |
| BC55PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 60.0 | 1000.0 | 63.0 | 250.0 | 150 | 100.0 | Y |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BC55-10PA | BC55-10PA,115 (934065807115) |
Active | BH |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC55-16PA | BC55-16PA,115 (934065808115) |
Active | BJ |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC55PA | BC55PA,115 (934065742115) |
Active | AW |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
文档 (6)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BC55PA_SER | 60 V, 1 A NPN medium power transistors | Data sheet | 2022-07-01 |
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020-3_SOT1061_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
