参数类型
| 型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74AVC1T45GM-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
| 74AVC1T45GS-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
| 74AVC1T45GW-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | TSSOP6 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74AVC1T45GM-Q100 | 74AVC1T45GM-Q100H (935299489125) |
Active | B5 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
| 74AVC1T45GS-Q100 | 74AVC1T45GS-Q100H (935690771125) |
Active | B5 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暂无信息 |
| 74AVC1T45GW-Q100 | 74AVC1T45GW-Q100H (935299491125) |
Active | B5 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AVC1T45GM-Q100 | 74AVC1T45GM-Q100H | 74AVC1T45GM-Q100 |
|
|
| 74AVC1T45GS-Q100 | 74AVC1T45GS-Q100H | 74AVC1T45GS-Q100 |
|
|
| 74AVC1T45GW-Q100 | 74AVC1T45GW-Q100H | 74AVC1T45GW-Q100 |
|
|
文档 (17)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74AVC1T45_Q100 | Dual-supply voltage level translator/transceiver; 3-state | Data sheet | 2024-07-02 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| avc1t45 | 74AVC1T45 IBIS model | IBIS model | 2016-02-24 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
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