参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74AUP2G3404GM | 0.8 - 3.6 | CMOS | ± 1.9 | 4.0 | 70 | 2 | ultra low | -40~125 | XSON6 |
| 74AUP2G3404GN | 0.8 - 3.6 | CMOS | ± 1.9 | 4.0 | 70 | 2 | ultra low | -40~125 | XSON6 |
| 74AUP2G3404GS | 0.8 - 3.6 | CMOS | ± 1.9 | 4.0 | 70 | 2 | ultra low | -40~125 | XSON6 |
| 74AUP2G3404GW | 0.8 - 3.6 | CMOS | ± 1.9 | 4.0 | 70 | 2 | ultra low | -40~125 | TSSOP6 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74AUP2G3404GM | 74AUP2G3404GM,125 (935297796125) |
Active | aZ |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
| 74AUP2G3404GN | 74AUP2G3404GN,125 (935297785125) |
Active | aZ |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
暂无信息 |
| 74AUP2G3404GS | 74AUP2G3404GS,125 (935297797125) |
Active | aZ |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暂无信息 |
| 74AUP2G3404GW | 74AUP2G3404GW,125 (935297794125) |
Active | aZ |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74AUP2G3404GF | 74AUP2G3404GF,132 (935297795132) |
Obsolete | aZ |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
SOT891_132 |
| 74AUP2G3404GF,125 (935297795125) |
Obsolete | aZ | 暂无信息 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP2G3404GM | 74AUP2G3404GM,125 | 74AUP2G3404GM |
|
|
| 74AUP2G3404GN | 74AUP2G3404GN,125 | 74AUP2G3404GN |
|
|
| 74AUP2G3404GS | 74AUP2G3404GS,125 | 74AUP2G3404GS |
|
|
| 74AUP2G3404GW | 74AUP2G3404GW,125 | 74AUP2G3404GW |
|
|
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP2G3404GF | 74AUP2G3404GF,132 | 74AUP2G3404GF |
|
|
| 74AUP2G3404GF | 74AUP2G3404GF,125 | 74AUP2G3404GF |
|
|
文档 (26)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74AUP2G3404 | Low-power buffer and inverter | Data sheet | 2023-07-28 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| aup2g3404 | IBIS model | IBIS model | 2014-06-04 |
| Nexperia_document_Logic_CombinationLogic_infocard_201710 | Combination logic solutions card | Leaflet | 2019-08-09 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| aup2g3404 | IBIS model | IBIS model | 2014-06-04 |
Ordering, pricing & availability
样品
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