参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVC2G34GM-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | XSON6 |
74LVC2G34GV-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | TSOP6 |
74LVC2G34GW-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | TSSOP6 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC2G34GM-Q100 | 74LVC2G34GM-Q100,1 (935299049125) |
Active | YA |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
74LVC2G34GV-Q100 | 74LVC2G34GV-Q100,1 (935299051125) |
Active | Y34 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
74LVC2G34GW-Q100 | 74LVC2G34GW-Q100,1 (935299052125) |
Active | YA |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC2G34GM-Q100 | 74LVC2G34GM-Q100,1 | 74LVC2G34GM-Q100 | ||
74LVC2G34GV-Q100 | 74LVC2G34GV-Q100,1 | 74LVC2G34GV-Q100 | ||
74LVC2G34GW-Q100 | 74LVC2G34GW-Q100,1 | 74LVC2G34GW-Q100 |
文档 (23)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC2G34_Q100 | Dual buffer gate | Data sheet | 2023-08-22 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
mnb063 | Block diagram: 74HC2G34GV, 74HC2G34GW, 74HCT2G34GV, 74HCT2G34GW, 74LVC2G34GF, 74LVC2G34GM, 74LVC2G34GV, 74LVC2G34GW, 74AUP2G34GF, 74AUP2G34GM, 74AUP2G34GW | Block diagram | 2009-11-03 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
lvc2g34 | 74LVC2G34 IBIS model | IBIS model | 2015-09-06 |
Nexperia_document_leaflet_Logic_Automotive_MicroPak_solutions_201904 | Automotive logic in MicroPak leadless packages | Leaflet | 2019-04-18 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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