参数类型
型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74LVC2T45DC-Q100 | 1.2 - 5.5 | 1.2 - 5.5 | CMOS/LVTTL | ± 24 | 2.5 | 2 | low | -40~125 | VSSOP8 |
74LVC2T45GS-Q100 | 1.2 - 5.5 | 1.2 - 5.5 | CMOS/LVTTL | ± 24 | 2.5 | 2 | low | -40~125 | XSON8 |
74LVC2T45GT-Q100 | 1.2 - 5.5 | 1.2 - 5.5 | CMOS/LVTTL | ± 24 | 2.5 | 2 | low | -40~125 | XSON8 |
74LVCH2T45DC-Q100 | 1.2 - 5.5 | 1.2 - 5.5 | CMOS/LVTTL | ± 24 | 2.5 | 2 | low | -40~125 | VSSOP8 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC2T45DC-Q100 | 74LVC2T45DC-Q100H (935300461125) |
Active | V45 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
74LVC2T45GS-Q100 | 74LVC2T45GS-Q100X (935690773115) |
Active | V5 |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
74LVC2T45GT-Q100 | 74LVC2T45GT-Q100X (935690702115) |
Active | V45 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 | |
74LVCH2T45DC-Q100 | 74LVCH2T45DC-Q100H (935301408125) |
Active | X45 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC2T45DC-Q100 | 74LVC2T45DC-Q100H | 74LVC2T45DC-Q100 | ||
74LVC2T45GS-Q100 | 74LVC2T45GS-Q100X | 74LVC2T45GS-Q100 | ||
74LVC2T45GT-Q100 | 74LVC2T45GT-Q100X | 74LVC2T45GT-Q100 | ||
74LVCH2T45DC-Q100 | 74LVCH2T45DC-Q100H | 74LVCH2T45DC-Q100 |
文档 (20)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC_LVCH2T45_Q100 | Dual supply translating transceiver; 3-state | Data sheet | 2023-08-09 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
lvc2t45 | lvc2t45 IBIS model | IBIS model | 2013-04-08 |
lvch2t45 | lvch2t45 IBIS model | IBIS model | 2013-04-09 |
Nexperia_document_leaflet_Logic_Automotive_MicroPak_solutions_201904 | Automotive logic in MicroPak leadless packages | Leaflet | 2019-04-18 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
lvc2t45 | lvc2t45 IBIS model | IBIS model | 2013-04-08 |
lvch2t45 | lvch2t45 IBIS model | IBIS model | 2013-04-09 |
Ordering, pricing & availability
样品
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