参数类型
型号 |
---|
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AXP1G125GM | 74AXP1G125GMH (935303214125) |
Withdrawn / End-of-life | rM |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
74AXP1G125GN | 74AXP1G125GNH (935303213125) |
Obsolete | no package information | ||||
74AXP1G125GS | 74AXP1G125GSH (935303212125) |
Withdrawn / End-of-life | rM |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暂无信息 |
74AXP1G125GX
|
74AXP1G125GXH (935303211125) |
Withdrawn / End-of-life | rM |
X2SON5 (SOT1226) |
SOT1226 |
REFLOW_BG-BD-1
|
SOT1226_125 |
环境信息
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AXP1G125GM | 74AXP1G125GMH | 74AXP1G125GM | ||
74AXP1G125GN | 74AXP1G125GNH | 74AXP1G125GN | ||
74AXP1G125GS | 74AXP1G125GSH | 74AXP1G125GS | ||
74AXP1G125GX
|
74AXP1G125GXH | 74AXP1G125GX |
文档 (19)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AXP1G125 | Low-power buffer/line driver; 3-state | Data sheet | 2021-09-30 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
axp1g125 | 74AXP1G125 IBIS model | IBIS model | 2014-10-22 |
Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
X2SON5_SOT1226_mk | plastic, thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT1226 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-30 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
MAR_SOT1226 | MAR_SOT1226 Topmark | Top marking | 2013-06-03 |
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