参数类型
| 型号 | Package version | Package name | Size (mm) | Channel type | Ptot (mW) | R2 (typ) (kΩ) | IC [max] (mA) | R1 (typ) (kΩ) | VCEO (V) |
|---|---|---|---|---|---|---|---|---|---|
| PUMB1 | SOT363 | TSSOP6 | 2.1 x 1.25 x 0.95 | PNP/PNP | 300 | 22 | 100 | 22 | 50 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| PUMB1 | PUMB1,115 (934057881115) |
Active | B%3 |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_115 |
| PUMB1,135 (934057881135) |
Active | B%3 | SOT363_135 | ||||
| PUMB1/1X (934661669115) |
Active | B%3 | SOT363_115 | ||||
| PUMB1/1F (934661669135) |
Active | B%3 | SOT363_135 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| PEMB1 | PEMB1,115 (934056869115) |
Obsolete | Z4 |
(SOT666) |
SOT666 |
REFLOW_BG-BD-1
|
SOT666_115 |
文档 (14)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| PEMB1_PUMB1 | PNP/PNP resistor-equipped transistors; R1 = 22 kOhm, R2 = 22 kOhm | Data sheet | 2011-12-15 |
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT666 | 3D model for products with SOT666 package | Design support | 2019-01-22 |
| SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT666_mk | plastic, surface-mounted package; 6 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body | Marcom graphics | 2017-01-28 |
| TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
| SOT666 | plastic, surface-mounted package; 6 leads; 0.5 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body | Package information | 2022-06-01 |
| SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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