外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| OL-IP3319CX6 | WLCSP6 | Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body | 2013-06-11 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| OL-IP3319CX6 | 3D model for products with OL-IP3319CX6 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-IP3319CX6 | Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body | Package information | 2022-07-13 |