外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOD128 | CFP5 | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | 2007-09-12 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封装的肖特基整流器 | Leaflet | 2022-07-01 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
CFP5_SOD128_mk | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOD128 | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Package information | 2022-05-27 |
SOD128_115 | Reel pack for SMD, 7''; Q1/T1-Q2/T3 product orientation | Packing information | 2020-06-11 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封装的产品
Automotive qualified products (AEC-Q100/Q101)
型号 | 描述 | 快速访问 |
---|---|---|
PTVS26VP1UTP | High-temperature 600 W Transient Voltage Suppressor |
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