外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT1160-1 | XQFN10 | plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | 2009-12-29 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT1160-1 | 3D model for products with SOT1160-1 package | Design support | 2019-10-03 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| XQFN10_SOT1160-1_mk | plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT1160-1 | plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-07 |
| SOT1160-1_115 | XQFN10; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2023-08-31 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| NXT4558GU-Q100 | SIM card interface level translator with enable pin |
|