外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT1289B | CFP15B | plastic, thermal enhanced ultra thin SMD package; 3 leads; 2.13 mm pitch; 5.8 x 4.3 x 0.95 mm body | 2019-01-10 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT1289B | 3D model for products with SOT1289B package | Design support | 2020-01-22 |
RS2624_CFP15BSide | RS2624_CFP15BSide | Marcom graphics | 2021-03-11 |
SOT1289B | plastic, thermal enhanced ultra thin SMD package; 3leads; 2.13 mm pitch; 5.8 x 4.3 x 0.95 mm body | Package information | 2023-06-02 |
SOT1289B_139 | CFP15B; Reel pack for SMD, 13"; Q4/T2 product orientation | Packing information | 2020-09-02 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封装的产品
Automotive qualified products (AEC-Q100/Q101)
型号 | 描述 | 快速访问 |
---|---|---|
PMEG100T100ELPE-Q | 100 V, 10 A low leakage current Trench Schottky barrier rectifier |
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