外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8022 | TO-247-2 | Plastic, single-ended package (heatsink mounted, 1 mounting hole) (TO-247-2); 2 leads; 10.88 mm pitch; 20.95 mm x 15.94 mm x 5.02 mm body | TO-247-2 (JEDEC) | 2021-02-10 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT8022 | 3D model for products with SOT8022 package | Design support | 2023-03-13 |
| SOT8022 | Plastic, single-ended package (heatsink mounted, 1 mounting hole) (TO-247-2); 2 leads; 10.88 mm pitch; 20.95 mm x 15.94 mm x 5.02 mm body | Package information | 2021-11-03 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |