外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8076-1 | HWQFN16 | plastic thermal enhanced very very thin Quad Flat packages; no leads; 16 terminals; 0.5 mm pitch; 3.0 × 3.0 × 0.75 mm body | MO-220 (WEED-4) (JEDEC) | 2023-03-20 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT8076-1 | plastic thermal enhanced very very thin Quad Flat packages;no leads; 16 terminals; 0.5 mm pitch; 3.0 × 3.0 × 0.75 mm body | Package information | 2023-03-28 |
| SOT8076-1_118 | HWQFN16; Reel pack for SMD; 13"; Q1/T1 product orientation | Packing information | 2023-04-03 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| NEH2000BY | Energy harvesting PMIC |
|