外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT96-1 | SO8 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | MS-012 (JEDEC) | 2003-02-18 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO8_SOT96-1_mk | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
SOT96-1 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Package information | 2020-04-21 |
SOT96-1_115 | Tape reel SMD; standard product orientation 12NC ending 115 | Packing information | 2020-04-27 |
SOT96-1_118 | SO8; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2022-12-21 |
SOT96-1_431 | SO8; Reel sulfur barrier pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,431 or Z Ordering code (12NC) ending 431 | Packing information | 2020-04-27 |
SOT96-1_515 | SO8; Reel dry pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending, 515 or Z Ordering code (12NC) ending 515 | Packing information | 2020-04-27 |
SOT96-1_518 | SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending, 518 or Y Ordering code (12NC) ending 518 | Packing information | 2020-04-27 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封装的产品
Analog & Logic ICs
型号 | 描述 | 快速访问 |
---|---|---|
NGD4300D | 4 A peak high-performance dual MOSFET gate driver |
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