外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| WLCSP15_6-3-6 | WLCSP15 | wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body | 2010-02-11 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP15_6-3-6 | wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 | PCMF3USB3X, PCMF3HDMI2X and PESD3USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 | Packing information | 2020-04-27 |
采用此封装的产品
ESD protection, TVS, filtering and signal conditioning
| 型号 | 描述 | 快速访问 |
|---|---|---|
| PCMF3USB3S | Common-mode EMI filter for differential channels with integrated ESD protection |
|