外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| WLCSP5_2-1-2 | WLCSP5 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | 2010-02-11 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
| WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
采用此封装的产品
ESD protection, TVS, filtering and signal conditioning
| 型号 | 描述 | 快速访问 |
|---|---|---|
| PCMF1USB3S | Common-mode EMI filter for differential channels with integrated ESD protection | |
| PCMF1HDMI2S | Common-mode EMI filter for differential channels with integrated ESD protection | |
| PCMF1USB30 | Common-mode EMI filter for differential channels with integrated ESD protection | |
| PESD1USB3S | ESD protection for differential data lines | |
| PCMF1HDMI14S | Common-mode EMI filter for differential channels with integrated ESD protection | |
| PCMF1USB3BA | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection | |
| PESD1USB30 | ESD protection for differential data lines | |
| PESD1USB3B | ESD protection for differential data lines | |
| PCMF1USB3B | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection |