外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT1061 | DFN2020-3 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | 2008-10-07 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020-3_SOT1061_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
| SOT1061_115 | DFN2020-3; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2020-04-21 |
| SOT1061_135 | DFN2020-3; Reel pack for SMD, 13"; Q2/T3 product orientation | Packing information | 2020-04-21 |
| SOT1061_147 | DFN2020-3; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2020-04-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
采用此封装的产品
Automotive qualified products (AEC-Q100/Q101)
| 型号 | 描述 | 快速访问 |
|---|---|---|
| BC69-16PA | 20 V, 2 A PNP medium power transistor |
|