外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT530-1 | TSSOP8 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | MO-153 (JEDEC) | 2003-02-18 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT530-1 | 3D model for products with SOT530-1 package | Design support | 2023-02-07 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT530-1 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-03 |
| SOT530-1_118 | TSSOP8; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2022-10-12 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| CBTD3306PW | Dual bus switch with level shifting |
|