外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT552-1 | TSSOP10 | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | 2003-02-18 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT552-1 | 3D model for products with SOT552-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP10_SOT552_mk | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT552-1 | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-07 |
| SOT552-1_118 | TSSOP10; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| 74AVC1T1022DP | 1-to-4 fan-out buffer |
|