外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
WLCSP10_4-2-4 | WLCSP10 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | 2010-02-11 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | PCMF2USB3X, PCMF2HDMI2X and PESD2USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 | Packing information | 2020-04-27 |
采用此封装的产品
ESD protection, TVS, filtering and signal conditioning
型号 | 描述 | 快速访问 |
---|---|---|
PCMF2USB3BA | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection | |
PCMF2HDMI14S | Common-mode EMI filter for differential channels with integrated ESD protection | |
PCMF2USB3S | Common-mode EMI filter for differential channels with integrated ESD protection | |
PCMF2HDMI2S | Common-mode EMI filter for differential channels with integrated ESD protection | |
PESD2USB3B | ESD protection for differential data lines | |
PCMF2USB30 | Common-mode EMI filter for differential channels with integrated ESD protection | |
PESD2USB30 | ESD protection for differential data lines | |
PESD2USB3S | ESD protection for differential data lines | |
PCMF2USB3B | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection |