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Click here for more information74HC238DB
3-to-8 line decoder/demultiplexer
The 74HC238; 74HCT238 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The device features three enable inputs (E1 and E2 and E3). Every output will be LOW unless E1 and E2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion to a 1-of-32 (5 to 32 lines) decoder with just four '238 ICs and one inverter. The '238 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
Alternatives
Features and benefits
Wide supply voltage range from 2.0 to 6.0 V
CMOS low power dissipation
High noise immunity
Demultiplexing capability
Multiple input enable for easy expansion
Ideal for memory chip select decoding
Active HIGH mutually exclusive outputs
Input levels:
For 74HC238: CMOS level
For 74HCT238: TTL level
Complies with JEDEC standards
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
型号 | Package name |
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74HC238DB | SSOP16 |
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
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封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
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74HC238DB | 74HC238DB,112 (935189270112) |
Obsolete | HC238 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
74HC238DB,118 (935189270118) |
Obsolete | HC238 | 暂无信息 |
Series
文档 (7)
文件名称 | 标题 | 类型 | 日期 |
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AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
No documents available
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.