双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC1T45GM-Q100

Dual supply translating transceiver; 3-state

The 74LVC1T45-Q100; 74LVCH1T45-Q100 are single bit, dual supply transceivers with 3-state outputs that enable bidirectional level translation. They feature two 1-bit input-output ports (A and B), a direction control input (DIR) and dual supply pins (VCC(A) and VCC(B)). Both VCC(A) and VCC(B) can be supplied with any voltage between 1.2 V and 5.5 V. This flexibility makes the device suitable for translating between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins A and DIR are referenced to VCC(A) and pin B is referenced to VCC(B). A HIGH on DIR allows transmission from A to B and a LOW on DIR allows transmission from B to A.

The devices are fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down. In suspend mode when either VCC(A) or VCC(B) are at GND level, both A port and B port are in the high-impedance OFF-state.

Active bus hold circuitry in the 74LVCH1T45-Q100 holds unused or floating data inputs at a valid logic level.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range:

    • VCC(A): 1.2 V to 5.5 V

    • VCC(B): 1.2 V to 5.5 V

  • High noise immunity

  • Maximum data rates:

    • 420 Mbps (3.3 V to 5.0 V translation)

    • 210 Mbps (translate to 3.3 V))

    • 140 Mbps (translate to 2.5 V)

    • 75 Mbps (translate to 1.8 V)

    • 60 Mbps (translate to 1.5 V)

  • Suspend mode

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • ±24 mA output drive (VCC = 3.0 V)

  • Inputs accept voltages up to 5.5 V

  • Low power consumption: 16 μA maximum ICC

  • IOFF circuitry provides partial Power-down mode operation

  • Complies with JEDEC standards:

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

参数类型

型号 VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Package name
74LVC1T45GM-Q100 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 XSON6

PCB Symbol, Footprint and 3D Model

Model Name 描述

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC1T45GM-Q100 74LVC1T45GM-Q100X
(935690846115)		 Active V5 SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC1T45GM-Q100 74LVC1T45GM-Q100X 74LVC1T45GM-Q100 rohs rhf rhf
品质及可靠性免责声明

Series

文档 (15)

文件名称 标题 类型 日期
74LVC_LVCH1T45_Q100 Dual supply translating transceiver; 3-state Data sheet 2023-08-04
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
lvc1t45 lvc1t45 IBIS model IBIS model 2013-04-08
Nexperia_document_leaflet_Logic_Automotive_MicroPak_solutions_201904 Automotive logic in MicroPak leadless packages Leaflet 2019-04-18
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT886_115 XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation Packing information 2020-04-21
74LVC1T45GM-Q100_Nexperia_Product_Reliability 74LVC1T45GM-Q100 Nexperia Product Reliability Quality document 2024-06-16
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
lvc1t45 lvc1t45 IBIS model IBIS model 2013-04-08
SOT886 3D model for products with SOT886 package Design support 2019-10-03

PCB Symbol, Footprint and 3D Model

Model Name 描述

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
74LVC1T45GM-Q100 74LVC1T45GM-Q100X 935690846115 Active SOT886_115 5,000 订单产品

样品

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How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
74LVC1T45GM-Q100 74LVC1T45GM-Q100X 935690846115 SOT886 订单产品