74LVC2GU04GM-Q100

Dual unbuffered inverter

Automotive qualified

The 74LVC2GU04-Q100 is a dual unbuffered inverter. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

Automotive product qualification in accordance with AEC-Q100 (Grade 1)
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.65 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
±24 mA output drive (V_CC = 3.0 V)
CMOS low power dissipation
Latch-up performance exceeds 250 mA
Complies with JEDEC standard no. 8-1A
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options

参数类型

型号	V_CC (V)	Logic switching levels	Output drive capability (mA)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	Package name
74LVC2GU04GM-Q100	1.65 - 5.5	CMOS/LVTTL	± 32	175	2	low	-40~125	XSON6

PCB Symbol, Footprint and 3D Model

Model Name	描述

封装

型号	可订购的器件编号，（订购码(12NC)）	状态	标示	封装	外形图	回流焊/波峰焊	包装
74LVC2GU04GM-Q100	74LVC2GU04GM-Q100, (935299056125)	Active	YD	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_125

环境信息

型号	可订购的器件编号	化学成分	RoHS	RHF指示符
74LVC2GU04GM-Q100	74LVC2GU04GM-Q100,	74LVC2GU04GM-Q100

品质及可靠性免责声明

Series

文档 (13)

文件名称	标题	类型	日期
74LVC2GU04_Q100	Dual unbuffered inverter	Data sheet	2023-08-25
Nexperia_document_guide_MiniLogic_MicroPak_201808	MicroPak leadless logic portfolio guide	Brochure	2018-09-03
SOT886	3D model for products with SOT886 package	Design support	2019-10-03
lvc2gu04	74LVC2GU04 IBIS model	IBIS model	2014-10-20
Nexperia_document_leaflet_Logic_Automotive_MicroPak_solutions_201904	Automotive logic in MicroPak leadless packages	Leaflet	2019-04-18
Nexperia_package_poster	Nexperia package poster	Leaflet	2020-05-15
DFN1410-6_SOT886_mk	plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Marcom graphics	2017-01-28
XSON6_SOT886_mk	plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Marcom graphics	2017-01-28
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
SOT886_125	XSON6; Reel pack for SMD, 7''; Q3/T4 product orientation	Packing information	2022-12-21
74LVC2GU04GM-Q100_Nexperia_Product_Reliability	74LVC2GU04GM-Q100 Nexperia Product Reliability	Quality document	2024-06-16
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03

支持

如果您需要设计/技术支持，请告知我们并填写应答表我们会尽快回复您。

模型

文件名称	标题	类型	日期
lvc2gu04	74LVC2GU04 IBIS model	IBIS model	2014-10-20
SOT886	3D model for products with SOT886 package	Design support	2019-10-03

PCB Symbol, Footprint and 3D Model

Model Name	描述

订购、定价与供货

型号	Orderable part number	Ordering code (12NC)	状态	包装	Packing Quantity	在线购买
74LVC2GU04GM-Q100	74LVC2GU04GM-Q100,	935299056125	Active	SOT886_125	5,000	订单产品

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How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册