双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

BCP55T

60 V, 1 A NPN medium power transistors

NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

Table 1. Table 1. Product Overview

Type number

Package

PNP complement

Nexperia

JEITA

JEDEC

BCP55T

SOT223

SC-73

-

BCP52T

BCP55-10T

BCP52-10T

BCP55-16T

BCP52-16T

Features and benefits

  • High collector current capability IC and ICM
  • Three current gain selections
  • High power dissipation capability
  • AEC-Q101 qualified

Applications

  • Linear voltage regulators
  • MOSFET drivers
  • High-side switches
  • Power management
  • Amplifiers

参数类型

型号 Package version Package name Size (mm) channel type (e) Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] TJ [max] (°C) fT [min] (MHz)
BCP55T SOT223 SC-73 6.5 x 3.5 x 1.65 NPN 600.0 60.0 1000.0 63.0 250.0 150 100.0

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
BCP55T BCP55TF
(934661086135)		 Active BCP55T SOT223
SC-73
(SOT223) 		SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_135

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BCP55T BCP55TF BCP55T rohs rhf rhf
品质及可靠性免责声明

Series

文档 (10)

文件名称 标题 类型 日期
BCP55T_SER 60 V, 1 A NPN medium power transistors Data sheet 2019-04-29
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
SOT223_135 SC-73; Reel pack for SMD, 13"; Q3/T4 product orientation Packing information 2024-02-15
BCP55T_Nexperia_Product_Reliability BCP55T Nexperia Product Reliability Quality document 2024-04-23
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BCP55T BCP55T SPICE model SPICE model 2024-08-27
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
BCP55T BCP55T SPICE model SPICE model 2024-08-27
SOT223 3D model for products with SOT223 package Design support 2019-01-22

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
BCP55T BCP55TF 934661086135 Active SOT223_135 4,000 订单产品

样品

作为 Nexperia 的客户，您可以通过我们的销售机构订购样品。

如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
BCP55T BCP55TF 934661086135 SOT223 订单产品