双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

BSP32

80 V, 1 A PNP medium power transistor

PNP medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. NPN complements: BSP41 and BSP43.

此产品已停产

Features and benefits

  • High current

  • High power dissipation capability

  • AEC-Q101 qualified

Applications

  • Linear voltage regulators

  • High-side switches

  • Battery-driven devices

  • Power management

  • MOSFET drivers

  • Amplifiers

参数类型

型号 Package version Package name Size (mm) channel type (e) Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] TJ [max] (°C) fT [min] (MHz) Automotive qualified
BSP32 SOT223 SC-73 6.5 x 3.5 x 1.65 PNP 1300.0 -80.0 -1000.0 40.0 120.0 150 100.0 Y

封装

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
BSP32 BSP32,115
(933981980115)		 Discontinued / End-of-life BSP32 SOT223
SC-73
(SOT223) 		SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115

环境信息

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BSP32 BSP32,115 BSP32 rohs rhf rhf
品质及可靠性免责声明

Series

文档 (11)

文件名称 标题 类型 日期
BSP31_32_33 PNP medium power transistors Data sheet 1999-04-25
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
LSYMTRA Letter Symbols - Transistors; General Other type 1999-05-06
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
BSP32_Nexperia_Product_Quality BSP32 Nexperia Product Quality Quality document 2017-05-16
BSP32_Nexperia_Product_Reliability BSP32 Nexperia Product Reliability Quality document 2024-04-23
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BSP32 BSP32 SPICE model SPICE model 2024-04-05
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
BSP32 BSP32 SPICE model SPICE model 2024-04-05
SOT223 3D model for products with SOT223 package Design support 2019-01-22

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册