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15 V, 0.5 A NPN low VCEsat (BISS) transistor
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package.
PNP complement: PBSS3515MB.
Features and benefits
Leadless ultra small SMD plastic package
Low package height of 0.37 mm
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High efficiency due to less heat generation
AEC-Q101 qualified
Reduced Printed-Circuit Board (PCB) requirements
Applications
DC-to-DC conversion
Supply line switching
Battery charger
LCD backlighting
Driver in low supply voltage applications (e.g. lamps and LEDs)
参数类型
型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|
PBSS2515MB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | NPN | 250.0 | 15.0 | 500.0 | 200.0 | 150 | 250.0 | Y |
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PBSS2515MB | PBSS2515MB,315 (934065875315) |
Discontinued / End-of-life | 0001 0001 |
DFN1006B-3 (SOT883B) |
SOT883B |
REFLOW_BG-BD-1
|
SOT883B_315 |
文档 (10)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS2515MB | 15 V, 0.5 A NPN low VCEsat (BISS) transistor | Data sheet | 2017-05-04 |
AN11045 | Next generation of NXP low VCEsat transistors: improved technology for discrete semiconductors | Application note | 2013-03-04 |
AN11076 | Thermal behavior of small-signal discretes on multilayer PCBs | Application note | 2021-06-23 |
SOT883B | 3D model for products with SOT883B package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1006B-3_SOT883B_mk | plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1 mm x 0.6 mm x 0.37 mm body | Marcom graphics | 2017-01-28 |
SOT883B | plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1.0 mm x 0.6 mm x 0.37 mm body | Package information | 2022-05-20 |
PBSS2515MB_Nexperia_Product_Reliability | PBSS2515MB Nexperia Product Reliability | Quality document | 2024-04-23 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PBSS2515MB | PBSS2515MB SPICE model | SPICE model | 2024-08-27 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS2515MB | PBSS2515MB SPICE model | SPICE model | 2024-08-27 |
SOT883B | 3D model for products with SOT883B package | Design support | 2020-01-22 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.