Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationPBSS4612PA
12 V, 6 A NPN low V_CEsat (BISS) transistor
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.
PNP complement: PBSS5612PA.
Alternatives
Features and benefits
- Low collector-emitter saturation voltage VCEsat
- High collector current capability IC and ICM
- Smaller required Printed-Circuit Board (PCB) area than for conventional transistors
- Exposed heat sink for excellent thermal and electrical conductivity
- Leadless small SMD plastic package with medium power capability
Applications
- Loadswitch
- Battery-driven devices
- Power management
- Charging circuits
- Power switches (e.g. motors, fans)
参数类型
| 型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4612PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 500.0 | 12.0 | 6000.0 | 280.0 | 50.0 | N |
封装
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| PBSS4612PA | PBSS4612PA,115 (934063489115) |
Obsolete | A5 |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
文档 (11)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| PBSS4612PA | 12 V, 6 A NPN low V_CEsat (BISS) transistor | Data sheet | 2010-05-19 |
| AN11045 | Next generation of NXP low VCEsat transistors: improved technology for discrete semiconductors | Application note | 2013-03-04 |
| AN11076 | Thermal behavior of small-signal discretes on multilayer PCBs | Application note | 2021-06-23 |
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020-3_SOT1061_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
| PBSS4612PA_Nexperia_Product_Quality | PBSS4612PA Nexperia Product Quality | Quality document | 2019-05-20 |
| PBSS4612PA_Nexperia_Product_Reliability | PBSS4612PA Nexperia Product Reliability Quality document | Quality document | 2020-03-11 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| PBSS4612PA | PBSS4612PA SPICE model | SPICE model | 2024-08-27 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| PBSS4612PA | PBSS4612PA SPICE model | SPICE model | 2024-08-27 |
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.
PBSS4612PA
12 V, 6 A NPN low V_CEsat (BISS) transistor
从安世半导体购买
| SKU | 库存* | MOQ | 单位价格 | 数量 |
|---|