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Very low capacitance unidirectional quadruple ESD protection diode arrays
Very low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in a leadless ultra small SOT891 Surface-Mounted Device (SMD) plastic package designed to protect up to four unidirectional signal lines from the damage caused by ESD and other transients.
Features and benefits
- ESD protection of up to four lines
- Very low diode capacitance
- Max. peak pulse power: PPP = 28W
- Low clamping voltage: VCL = 9.5V
- AEC-Q101 qualified
- Very low leakage current: IRM = 0.1 μA
- ESD protection up to 15 kV
- IEC 61000-4-2; level 4 (ESD)
- IEC 61000-4-5 (surge); IPP = 2.7A
Applications
- Computers and peripherals
- Audio and video equipment
- Cellular handsets and accessories
- Communication systems
- Portable electronics
- Subscriber Identity Module (SIM) card protection
参数类型
型号 | Package name |
---|---|
PESD3V3V4UK | XSON6 |
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PESD3V3V4UK | PESD3V3V4UK,132 (934063975132) |
Obsolete |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
SOT891_132 |
文档 (10)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PESDXV4UK_SER | Very low capacitance unidirectional quadruple ESD protection diode arrays | Data sheet | 2022-05-03 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PESD3V3V4UK | PESD3V3V4UK SPICE model | SPICE model | 2012-07-22 |
PESD3V3V4UK | PESD3V3V4UK SPICE model | SPICE model | 2024-10-14 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PESD3V3V4UK | PESD3V3V4UK SPICE model | SPICE model | 2012-07-22 |
PESD3V3V4UK | PESD3V3V4UK SPICE model | SPICE model | 2024-10-14 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.