可订购部件
型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
---|---|---|---|---|
PSMN1R7-40YLB | PSMN1R7-40YLBX | 934665890115 | SOT669 | 订单产品 |
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Click here for more informationN-channel 40 V, 1.8 mOhm, 200 A logic level MOSFET in LFPAK56 using optimized NextPowerS3 Schottky-Plus technology
200 A, logic level gate drive N-channel enhancement mode MOSFET in 175 °C LFPAK56 package, using advanced TrenchMOS Superjunction technology with optimization to provide improved EMC performance (up to 6 dB). This product has been designed and qualified for high performance power switching applications.
Optimized for improved EMC Performance
200 A continuous ID(max) rating
Avalanche rated, 100% tested at IAS = 180 A
Strong SOA (linear-mode) rating
NextPowerS3 technology delivers 'superfast switching with soft body-diode recovery'
Low Qrr, QG and QGD for high system efficiency and low EMI designs
Schottky-Plus body-diode with low VSD, low Qrr, soft recovery and low IDSS leakage
Optimized for 4.5 V gate drive utilizing NextPowerS3 Superjunction technology
High reliability LFPAK (Power SO8) package, with copper-clip and solder die attach, qualified to 175 °C
Exposed leads can be wave soldered, visual solder joint inspection and high quality solder joints providing excellent board level reliability
Low parasitic inductance and resistance
Automation, control and instrumentation
Autonomous systems, Robotics and Cobots
DC-to-DC converters
Brushless DC motor control
Brushed motors
Battery isolation
Industrial load-switch and eFuse
Inrush management, hotswap
型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PSMN1R7-40YLB | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 40 | 1.8 | 2.3 | 175 | 200 | 7.3 | 35 | 79 | 194 | 26 | 1.75 | N | 5813 | 1422 | 2023-10-24 |
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PSMN1R7-40YLB | PSMN1R7-40YLBX (934665890115) |
Active | 1B7L40Y |
LFPAK56; Power-SO8 (SOT669) |
SOT669 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT669_115 |
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PSMN1R7-40YLB | N-channel 40 V, 1.8 mOhm, 200 A logic level MOSFET in LFPAK56 using optimized NextPowerS3 Schottky-Plus technology | Data sheet | 2024-02-13 |
AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
AN11160 | Designing RC Snubbers | Application note | 2024-10-21 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN50014 | Understanding the MOSFET peak drain current rating | Application note | 2022-03-28 |
AN90003 | LFPAK MOSFET thermal design guide | Application note | 2023-08-22 |
AN90011 | Half-bridge MOSFET switching and its impact on EMC | Application note | 2020-04-28 |
AN90016 | Maximum continuous currents in NEXPERIA LFPAK power MOSFETs | Application note | 2020-09-03 |
AN90034 | Nexperia Precision Electrothermal models in SPICE and VHDL-AMS for Power MOSFETs | Application note | 2024-04-30 |
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
LFPAK56_POWER-SO8_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
PSMN1R7-40YLB_V1_1 | PSMN1R7-40YLB Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2024-03-13 |
SOT669 | plastic, single-ended surface-mounted package; 4 terminals | Package information | 2022-05-30 |
SOT669_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-05-10 |
Reliability_information_t9_sot669 | Reliability information t9_sot669 | Quality document | 2022-10-18 |
T9_SOT669_PSMN1R7-40YLB_Nexperia_Quality_document | PSMN1R7-40YLB Quality document | Quality document | 2023-11-14 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PSMN1R7-40YLB | PSMN1R7-40YLB SPICE model | SPICE model | 2023-11-06 |
CauerModel_PSMN1R7-40YLB | Cauer model PSMN1R7-40YLB | Thermal model | 2023-11-03 |
FosterModel_PSMN1R7-40YLB | Foster model PSMN1R7-40YLB | Thermal model | 2023-11-03 |
PSMN1R7-40YLB | PSMN1R7-40YLB RC thermal model | Thermal model | 2023-11-03 |
PSMN1R7-40YLB_Cauer | PSMN1R7-40YLB Cauer model | Thermal model | 2023-11-03 |
PSMN1R7-40YLB_Foster | PSMN1R7-40YLB Foster model | Thermal model | 2023-11-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PSMN1R7-40YLB_V1_1 | PSMN1R7-40YLB Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2024-03-13 |
PSMN1R7-40YLB | PSMN1R7-40YLB SPICE model | SPICE model | 2023-11-06 |
CauerModel_PSMN1R7-40YLB | Cauer model PSMN1R7-40YLB | Thermal model | 2023-11-03 |
FosterModel_PSMN1R7-40YLB | Foster model PSMN1R7-40YLB | Thermal model | 2023-11-03 |
PSMN1R7-40YLB | PSMN1R7-40YLB RC thermal model | Thermal model | 2023-11-03 |
PSMN1R7-40YLB_Cauer | PSMN1R7-40YLB Cauer model | Thermal model | 2023-11-03 |
PSMN1R7-40YLB_Foster | PSMN1R7-40YLB Foster model | Thermal model | 2023-11-03 |
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
---|---|---|---|---|---|---|
PSMN1R7-40YLB | PSMN1R7-40YLBX | 934665890115 | Active | SOT669_115 | 1,500 | 订单产品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.