可订购部件
型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
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PSMN2R3-100SSJ | PSMN2R3-100SSJJ | 934661617118 | SOT1235 | 订单产品 |
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Click here for more informationN-channel 100 V, 2.3 mOhm ASFET with enhanced dynamic current sharing in LFPAK88
N-channel enhancement mode MOSFET in a LFPAK88 package qualified to 175 °C. Part of Nexperia's Application Specific MOSFETs (ASFETs) for enhanced dynamic current sharing in parallel. The PSMN2R3-100SSJ delivers very low RDSon and high current capability along with enhanced dynamic current sharing in a high-reliability copper-clip LFPAK88 package. The dynamic current sharing feature is a passive solution and inherent in the optimised design and does not rely upon special selections or control and feedback methods.
Fully enhanced for dynamic current sharing in parallel
Suitable for 10 V gate drive
Low RDSon for low I²R conduction losses
LFPAK88 package for applications that demand the highest performance and reliability
High power motor drives
Fork lift trucks and material moving equipment
Industrial drives and Automation
High power tools and machines
E-bike and mobility
E-Fuse and high current switching
型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
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PSMN2R3-100SSJ | SOT1235 | LFPAK88 | Development | N | 1 | 100 | 2.3 | 175 | 255 | 8 | 280 | 341 | 147 | 2.2 | N | 24840 | 2683 | 2023-05-24 |
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
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PSMN2R3-100SSJ | PSMN2R3-100SSJJ (934661617118) |
Development | X2J3S10S |
LFPAK88 (SOT1235) |
SOT1235 |
REFLOW_BG-BD-1
|
SOT1235_118 |
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PSMN2R3-100SSJ | N-channel 100 V, 2.3 mOhm ASFET with enhanced dynamic current sharing in LFPAK88 | Data sheet | 2024-10-24 |
SOT1235 | 3D model for products with SOT1235 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
LFPAK88_sot1235_mk | plastic, single-ended surface-mounted package (LFPAK88); 4 leads; 2 mm pitch; 8 mm x 8 mm x 1.6 mm body | Marcom graphics | 2019-04-10 |
SOT1235 | plastic, single-ended surface-mounted package (LFPAK88); 4 leads; 2 mm pitch; 8 mm x 8 mm x 1.6 mm body | Package information | 2022-05-30 |
SOT1235_118 | LFPAK88; Reel pack, SMD, 13"; Q1/T1 standard product orientation; Orderable part number ending ,118 or Z; Ordering code (12NC) ending 118 | Packing information | 2020-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
文件名称 | 标题 | 类型 | 日期 |
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SOT1235 | 3D model for products with SOT1235 package | Design support | 2020-01-22 |
型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.