参数类型
| 型号 | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| HEF4051BT | SP8T-Z | 3.0 - 15 | CMOS | 175 | 30 | 70 | 0.04 | -50 | very low | -40~85 | SO16 |
| HEF4051BTT | SP8T-Z | 3.0 - 15 | CMOS | 175 | 30 | 70 | 0.04 | -50 | very low | -40~85 | TSSOP16 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| HEF4051BT | HEF4051BT,013 (933372940013) |
Active | HEF4051BT |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
暂无信息 |
| HEF4051BT,653 (933372940653) |
Active | HEF4051BT | 暂无信息 | ||||
| HEF4051BTT | HEF4051BTT,118 (935278637118) |
Active | HEF4051 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| HEF4051BT | HEF4051BT,013 | HEF4051BT |
|
|
| HEF4051BT | HEF4051BT,653 | HEF4051BT |
|
|
| HEF4051BTT | HEF4051BTT,118 | HEF4051BTT |
|
|
文档 (16)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| HEF4051B | 8-channel analog multiplexer/demultiplexer | Data sheet | 2024-07-25 |
| AN11051 | Pin FMEA HEF4000 family | Application note | 2019-01-09 |
| mgr578 | Block diagram: HEF4051BP, HEF4051BT, HEF4051BTT | Block diagram | 2009-11-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| hef4051b | HEF4051B IBIS model | IBIS model | 2019-01-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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