双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74CBTLV3253

Dual 1-of-4 multiplexer/demultiplexer

The 74CBTLV3253 provides a dual 1-of-4 high-speed multiplexer/demultiplexer with two common select inputs (S0, S1) and two output enable inputs (1OE, 2OE). The low ON resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. When pin nOE = LOW, one of the four switches is selected (low-impedance ON-state) with pins S0 and S1. When pin nOE = HIGH, all switches are in the high-impedance OFF-state, independent of pins S0 and S1.

To ensure the high-impedance OFF-state during power-up or power-down, nOE should be tied to the VCC through a pull-up resistor. The minimum value of the resistor is determined by the current-sinking capability of the driver.

Schmitt trigger action at control input makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 2.3 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Features and benefits

  • Supply voltage range from 2.3 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8-B/JESD36 (2.7 V to 3.6 V)

  • 5 Ω switch connection between two ports

  • Rail to rail switching on data I/O ports

  • CMOS low power consumption

  • Latch-up performance exceeds 250 mA per JESD78B Class I level A

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) VPASS (V) Logic switching levels RON (Ω) f(-3dB) (MHz) Nr of bits tpd (ns) Power dissipation considerations Tamb (°C) Package name
74CBTLV3253BQ 2.3 - 3.6 3.3 CMOS/LVTTL 7 400 2 0.2 very low -40~125 DHVQFN16
74CBTLV3253D 2.3 - 3.6 3.3 CMOS/LVTTL 7 400 2 0.2 very low -40~125 SO16
74CBTLV3253DS 2.3 - 3.6 3.3 CMOS/LVTTL 7 400 2 0.2 very low -40~125 SSOP16
74CBTLV3253PW 2.3 - 3.6 3.3 CMOS/LVTTL 7 400 2 0.2 very low -40~125 TSSOP16

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74CBTLV3253BQ 74CBTLV3253BQ,115
(935289997115)		 Active TV3253 SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74CBTLV3253D 74CBTLV3253D,118
(935289998118)		 Active 74CBTLV3253D SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74CBTLV3253DS 74CBTLV3253DS,118
(935290001118)		 Active TLV3253 SOT519-1
SSOP16
(SOT519-1) 		SOT519-1 SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE
SOT519-1_118
74CBTLV3253PW 74CBTLV3253PW,118
(935289999118)		 Active TLV3253 SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74CBTLV3253BQ 74CBTLV3253BQ,115 74CBTLV3253BQ rohs rhf rhf
74CBTLV3253D 74CBTLV3253D,118 74CBTLV3253D rohs rhf rhf
74CBTLV3253DS 74CBTLV3253DS,118 74CBTLV3253DS rohs rhf rhf
74CBTLV3253PW 74CBTLV3253PW,118 74CBTLV3253PW rohs rhf rhf
品质及可靠性免责声明

文档 (20)

文件名称 标题 类型 日期
74CBTLV3253 Dual 1-of-4 multiplexer/demultiplexer Data sheet 2024-04-23
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT519-1 3D model for products with SOT519-1 package Design support 2023-02-07
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
cbtlv3253 cbtlv3253 IBIS model IBIS model 2013-04-08
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT519-1 plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body Package information 2022-06-20
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SSOP-TSSOP-VSO-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT519-1 3D model for products with SOT519-1 package Design support 2023-02-07
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
cbtlv3253 cbtlv3253 IBIS model IBIS model 2013-04-08

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