双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74AUP1G34

Low-power buffer

The 74AUP1G34 is a single buffer. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74AUP1G34GM 0.8 - 3.6 CMOS ± 1.9 70 1 ultra low -40~125 XSON6
74AUP1G34GN 0.8 - 3.6 CMOS ± 1.9 70 1 ultra low -40~125 XSON6
74AUP1G34GS 0.8 - 3.6 CMOS ± 1.9 70 1 ultra low -40~125 XSON6
74AUP1G34GW 0.8 - 3.6 CMOS ± 1.9 70 1 ultra low -40~125 TSSOP5
74AUP1G34GX 0.8 - 3.6 CMOS ± 1.9 70 1 ultra low -40~125 X2SON5
74AUP1G34GX4 0.8 - 3.6 CMOS ± 1.9 70 1 ultra low -40~125 X2SON4

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP1G34GM 74AUP1G34GM,115
(935279029115)		 Active aN SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
74AUP1G34GM,132
(935279029132)		 Active aN SOT886_132
74AUP1G34GN 74AUP1G34GN,132
(935291737132)		 Active aN SOT1115
XSON6
(SOT1115) 		SOT1115 REFLOW_BG-BD-1
SOT1115_132
74AUP1G34GS 74AUP1G34GS,132
(935292862132)		 Active aN SOT1202
XSON6
(SOT1202) 		SOT1202 REFLOW_BG-BD-1
SOT1202_132
74AUP1G34GW 74AUP1G34GW/C7H
(935691930125)		 Active aN SOT353-1
TSSOP5
(SOT353-1) 		SOT353-1 WAVE_BG-BD-1
SOT353-1_125
74AUP1G34GW,125
(935279028125)		 Active aN SOT353-1_125
74AUP1G34GX 74AUP1G34GX,125
(935298363125)		 Active aN SOT1226-3
X2SON5
(SOT1226-3) 		SOT1226-3 SOT1226-3_125
74AUP1G34GX4 74AUP1G34GX4Z
(935340118147)		 Active aN SOT1269-2
X2SON4
(SOT1269-2) 		SOT1269-2 SOT1269-2_147

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP1G34GM 74AUP1G34GM,115 74AUP1G34GM rohs rhf rhf
74AUP1G34GM 74AUP1G34GM,132 74AUP1G34GM rohs rhf rhf
74AUP1G34GN 74AUP1G34GN,132 74AUP1G34GN rohs rhf rhf
74AUP1G34GS 74AUP1G34GS,132 74AUP1G34GS rohs rhf rhf
74AUP1G34GW 74AUP1G34GW/C7H 74AUP1G34GW rohs rhf rhf
74AUP1G34GW 74AUP1G34GW,125 74AUP1G34GW rohs rhf rhf
74AUP1G34GX 74AUP1G34GX,125 74AUP1G34GX rohs rhf rhf
74AUP1G34GX4 74AUP1G34GX4Z 74AUP1G34GX4 rohs rhf rhf
品质及可靠性免责声明

文档 (33)

文件名称 标题 类型 日期
74AUP1G34 Low-power buffer Data sheet 2023-07-13
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11052 Pin FMEA for AUP family Application note 2019-01-09
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
SOT1269-2 3D model for products with SOT1269-2 package Design support 2023-02-02
SOT1269 3D model for products with SOT1269 package Design support 2019-10-07
aup1g34 74AUP1G34 IBIS model IBIS model 2018-05-25
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
XSON4_SOT1269-2_mk plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body Marcom graphics 2019-02-04
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
SOT1226-3 plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm Package information 2020-08-27
SOT1269-2 plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body Package information 2020-08-18
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

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模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
SOT1269-2 3D model for products with SOT1269-2 package Design support 2023-02-02
SOT1269 3D model for products with SOT1269 package Design support 2019-10-07
aup1g34 74AUP1G34 IBIS model IBIS model 2018-05-25

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