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74AXP1G17
Low-power Schmitt trigger
The 74AXP1G17 is a single Schmitt trigger buffer. It can transform slowly changing input signals into sharply defined, jitter-free output signals.
This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. It is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.7 V to 2.75 V
Low input capacitance; CI = 0.5 pF (typical)
Low output capacitance; CO = 1.0 pF (typical)
Low dynamic power consumption; CPD = 2.5 pF at VCC = 1.2 V (typical)
Low static power consumption; ICC = 0.6 μA (85 °C maximum)
High noise immunity
Complies with JEDEC standard:
JESD8-12A.01 (1.1 V to 1.3 V)
JESD8-11A.01 (1.4 V to 1.6 V)
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A.01 (2.3 V to 2.7 V)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
CDM JESD22-C101E exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 2.75 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Multiple package options
Specified from -40 °C to +85 °C
参数类型
型号 |
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封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AXP1G17GM | 74AXP1G17GMH (935304102125) |
Withdrawn / End-of-life | rJ |
![]() XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
74AXP1G17GN | 74AXP1G17GNH (935304103125) |
Obsolete | no package information | ||||
74AXP1G17GS | 74AXP1G17GSH (935304104125) |
Obsolete | no package information | ||||
74AXP1G17GX | 74AXP1G17GXH (935304105125) |
Withdrawn / End-of-life | rJ |
![]() X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 |
环境信息
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AXP1G17GM | 74AXP1G17GMH | 74AXP1G17GM |
|
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74AXP1G17GN | 74AXP1G17GNH | 74AXP1G17GN |
|
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74AXP1G17GS | 74AXP1G17GSH | 74AXP1G17GS |
|
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74AXP1G17GX | 74AXP1G17GXH | 74AXP1G17GX |
|
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文档 (14)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AXP1G17 | Low-power Schmitt trigger | Data sheet | 2021-09-30 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
支持
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Ordering, pricing & availability
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