![](/.resources/nexperia-theme/images/no-image-series_nexperia.jpg)
74LVT14
3.3 V hex inverter Schmitt trigger
The 74LVT14 is a hex inverter with Schmitt-trigger inputs. Bus hold data inputs eliminate the need for external pull-up resistors to define unused inputs. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Different positive and negative going input threshold voltages
Tolerant of slow input transitions
Wide supply voltage range from 2.7 V to 3.6 V
Overvoltage tolerant inputs to 5.5 V
BiCMOS high speed and output drive
Output capability: +32 mA/-20 mA
High noise immunity
Direct interface with TTL levels
No bus current loading when output is tied to 5 V bus
Power-up 3-state
IOFF circuitry provides partial Power-down mode operation
Latch-up protection exceeds 500 mA per JESD78 class II level A
Complies with JEDEC standard JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C
参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVT14BQ | 2.7 - 3.6 | TTL | -32/+64 | 150 | 6 | medium | -40~85 | DHVQFN14 |
74LVT14D | 2.7 - 3.6 | TTL | -32/+64 | 150 | 6 | medium | -40~85 | SO14 |
74LVT14PW | 2.7 - 3.6 | TTL | -32 / +64 | 150 | 6 | medium | -40~85 | TSSOP14 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVT14BQ | 74LVT14BQ,115 (935285599115) |
Active | LVT14 |
![]() DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
74LVT14D | 74LVT14D,118 (935209170118) |
Active | 74LVT14D |
![]() SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74LVT14PW | 74LVT14PW,118 (935209190118) |
Active | LVT14 |
![]() TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVT14D | 74LVT14D,112 (935209170112) |
Withdrawn / End-of-life | 74LVT14D |
![]() SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_112 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVT14BQ | 74LVT14BQ,115 | 74LVT14BQ |
|
![]() |
74LVT14D | 74LVT14D,118 | 74LVT14D |
|
![]() |
74LVT14PW | 74LVT14PW,118 | 74LVT14PW |
|
![]() |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVT14D | 74LVT14D,112 | 74LVT14D |
|
![]() |
文档 (16)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVT14 | 3.3 V hex inverter Schmitt trigger | Data sheet | 2024-01-25 |
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。