参数类型
| 型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|
| NXB0102DC | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 2 | low | -40~125 | VSSOP8 | Bi-directional | AutoSense |
| NXB0102GT | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 2 | low | -40~125 | XSON8 | Bi-directional | AutoSense |
| NXB0102UN | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 2 | low | -40~125 | WLCSP8 | Bi-directional | AutoSense |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| NXB0102DC | NXB0102DCH (935690922125) |
Active | n2 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
| NXB0102GT | NXB0102GTX (935690921115) |
Active | n2 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 | |
| NXB0102UN | NXB0102UNAZ (935691107336) |
Active | n2 |
WLCSP8 (SOT8023-1) |
SOT8023-1 | SOT8023-1_336 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| NXB0102UN | NXB0102UNZ (935691107084) |
Withdrawn / End-of-life | n2 |
WLCSP8 (SOT8023-1) |
SOT8023-1 | 暂无信息 |
文档 (13)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| NXB0102 | Dual supply translating transceiver; auto direction sensing; 3-state | Data sheet | 2023-11-15 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| SOT8023-1 | 3D model for products with SOT8023-1 package | Design support | 2023-02-07 |
| nxb0102 | NXB0102 IBIS model | IBIS model | 2020-02-26 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| SOT8023-1 | wafer level chip-scale package, 8 bumps; 0.75 x 1.55 x 0.60 mm | Package information | 2022-04-20 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| SOT8023-1 | 3D model for products with SOT8023-1 package | Design support | 2023-02-07 |
| nxb0102 | NXB0102 IBIS model | IBIS model | 2020-02-26 |