双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

NXS0102

Dual supply translating transceiver; open drain; auto direction sensing

The NXS0102 is a 2-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 2-bit input-output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.65 V and 3.6 V and VCC(B) can be supplied at any voltage between 2.3 V and 5.5 V, making the device suitable for translating between any of the voltage nodes (1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range:

    • VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V

  • Maximum data rates:

    • Push-pull: 24 Mbps

  • IOFF circuitry provides partial Power-down mode operation

  • Inputs accept voltages up to 5.5 V

  • Latch-up performance exceeds 100 mA per JESD 78B Class II

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 8000 V for B port

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Applications

  • Desktop PC

  • Handset

  • Smartphone

  • Tablet

参数类型

型号 VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Package name
NXS0102DC 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 5.2 2 low -40~125 VSSOP8
NXS0102GT 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 5.2 2 low -40~125 XSON8
NXS0102UN 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 5.2 2 low -40~125 WLCSP8

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
NXS0102DC NXS0102DCH
(935690905125)		 Active m2 SOT765-1
VSSOP8
(SOT765-1) 		SOT765-1 SOT765-1_125
NXS0102GT NXS0102GTX
(935690913115)		 Active m2 SOT833-1
XSON8
(SOT833-1) 		SOT833-1 SOT833-1_115
NXS0102UN NXS0102UNAZ
(935691106336)		 Active m2 SOT8023-1
WLCSP8
(SOT8023-1) 		SOT8023-1 SOT8023-1_336

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
NXS0102UN NXS0102UNZ
(935691106084)		 Withdrawn / End-of-life m2 SOT8023-1
WLCSP8
(SOT8023-1) 		SOT8023-1 暂无信息

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
NXS0102DC NXS0102DCH NXS0102DC rohs rhf rhf
NXS0102GT NXS0102GTX NXS0102GT rohs rhf rhf
NXS0102UN NXS0102UNAZ NXS0102UN rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
NXS0102UN NXS0102UNZ NXS0102UN rohs rhf rhf
品质及可靠性免责声明

文档 (13)

文件名称 标题 类型 日期
NXS0102 Dual supply translating transceiver; open drain; auto direction sensing Data sheet 2023-11-16
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
SOT8023-1 3D model for products with SOT8023-1 package Design support 2023-02-07
nxs0102 NXS0102 IBIS model IBIS model 2020-11-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
VSSOP8_SOT765-1_mk plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Marcom graphics 2017-01-28
SOT765-1 plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Package information 2022-06-03
SOT833-1 plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body Package information 2022-06-03
SOT8023-1 wafer level chip-scale package, 8 bumps; 0.75 x 1.55 x 0.60 mm Package information 2022-04-20
MAR_SOT833 MAR_SOT833 Topmark Top marking 2013-06-03

支持

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模型

文件名称 标题 类型 日期
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
SOT8023-1 3D model for products with SOT8023-1 package Design support 2023-02-07
nxs0102 NXS0102 IBIS model IBIS model 2020-11-05

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